Advantech MIC-770 V3
Compact Fanless System with 12th Gen Intel® Core? i CPU Socket (LGA 1700)
- Intel® 12th Gen Core? i CPU socket-type (LGA1700) with Intel® R680E/ H610E chipset
- Wide operating temperature (-20 ~ 60 °C); VGA and HDMI output;
- 2 x GigaLAN, 2 x USB 3.2 (Gen2) and 6 x USB 3.2 (Gen1); 2 x RS-232/422/485 and 4 x RS232 serial ports (Optional)
- 1 x 2.5" HDD/SSD, 1 x mSATA, and 1 x NVMe M.2; 9 ~ 36 VDC input power range
- IP40 dust proof for deployment in harsh environment
- Supports FlexIO and iDoor technology, flexible configure additional HDMI, DP, DVI, COM port, DIO, Remote switch IO
- Supports Advantech i-Modules; Supports Advantech SUSIAPI and embedded software APIs
- Supports Intel® vPro?/AMT and TPM technologies
- Supports Advantech iBMC 1.2 remote out-of-band power management solution on WISE-DeviceOn
MIC-770 V3 is compact and fanless industrial computer is designed to deliver powerful computing, as well
as security and manageability features, to fulfill multi-application in factory and machine automation.
MIC-770 V3 adopts with R680E can support DDR5 ECC RAM, and could operate with 65W Intel i9-12900(E) CPU at 50 degree or adjust CPU TDP to 35W in BIOS at 60 degree. Higher operating temperature supported, MIC-770 V3 is more competitive and suitable to be deployed in thermal challenging environment.
MIC-770 V3 with R680E supports iBMC 1.2 for remote out of band control and remote data backup in order to reduce system downtime and save maintenance cost.
Moverover, MIC-770 V3 support rich I/O in one single side and up to four display, the flexible extension design with iDoor, FlexIO and iModule technology and flexible configure in your local CTOS manufacture to meet different customization requirements. MIC-770 V3 with iModule can deliver massive AI processing to meet AI, deep learning and similar applications requiring high-speed processing.
With promising whole system fanless reliability, excellent performance and functionality, we strongly believe that MIC-770 V3 can help your automation, intelligent transportation and some brand new Edge AI IOT application such as GPU card computing or autonomous.
MIC-770 V3 adopts with R680E can support DDR5 ECC RAM, and could operate with 65W Intel i9-12900(E) CPU at 50 degree or adjust CPU TDP to 35W in BIOS at 60 degree. Higher operating temperature supported, MIC-770 V3 is more competitive and suitable to be deployed in thermal challenging environment.
MIC-770 V3 with R680E supports iBMC 1.2 for remote out of band control and remote data backup in order to reduce system downtime and save maintenance cost.
Moverover, MIC-770 V3 support rich I/O in one single side and up to four display, the flexible extension design with iDoor, FlexIO and iModule technology and flexible configure in your local CTOS manufacture to meet different customization requirements. MIC-770 V3 with iModule can deliver massive AI processing to meet AI, deep learning and similar applications requiring high-speed processing.
With promising whole system fanless reliability, excellent performance and functionality, we strongly believe that MIC-770 V3 can help your automation, intelligent transportation and some brand new Edge AI IOT application such as GPU card computing or autonomous.
Specifications
- 12th Generation Processor (TDP 35W)
CPU | i9-12900TE | i7-12700TE | i5-12500TE | i3-12100TE | Pentium G7400TE | Celeron G6900TE |
Core/Thread number | 16/24 | 12/20 | 6/12 | 4/8 | 2/4 | 2/2 |
Base Frequency | 1.10 GHz | 1.40 GHz | 1.90 GHz | 2.10 GHz | 3.00 GHz | 2.4 GHz |
Max Tirbo Frequency | 4.80 GHz | 4.60 GHz | 4.30 GHz | 4.00 GHz | ||
L3 Cache | 30 MB | 16 MB | 12 MB | 6 MB | 2.5MB | 2.5MB |
Temperature | -20 ~ 60 °C (w/ industrial wide-temp SSD, 0.7m/s air flow) | |||||
Chipset | R680E/H610E | |||||
BIOS | AMI 256Mb/128Mb SPI Flash |
12 th Generation Processor (TDP 65W)
CPU | i9-12900(E) | i7-12700(E) | i5-12500(E) | i3-12100(E) | G7400E (46W) | G6900E (46W) |
Core/Thread number | 16/24 | 12/20 | 6/12 | 4/8 | 2/4 | 2/2 |
Base Frequency | 2.30 GHz | 2.10 GHz | 2.90 GHz | 3.20 GHz | 3.60 GHz | 3.00 GHz |
Max Tirbo Frequency | 5.00 GHz | 4.80 GHz | 4.50 GHz | 4.20 GHz | ||
L3 Cache | 30 MB | 25 MB | 18 MB | 5 MB | 2.5 MB | 2.5 MB |
Temperature | -20 ~ 50 °C (w/ industrial wide-temp SSD, 0.7m/s air flow) | |||||
Chipset | R680E/H610E | |||||
BIOS AMI | 256Mb/128Mb SPI Flash |
Memory
- Technology
Dual-channel DDR5 4800 MHz (R680E SKU supports ECC)
Socket
2 x 260-pin DDR5 SODIMM (up to 32GB per socket)
Maximum Capacity
64GB
Display
- Chipset
Core i: Intel ® UHD Graphics 770
Pentium/Celeron: Intel® HD Graphics 710
VGA
1 x DB15, up to 1920 x 1200 maximum resolution
HDMI
1 x HDMI, up to 4096 x 2160@30Hz
Multiple Display
R680E: 4 x independent displays (third and fourth display output via optional cable)
H610E: 3 x independent displays (third display output via optional cable)
Ethernet
- Controller
R680E LAN1: Intel ® I219LM, LAN2: Intel® i210IT
H610E LAN1: Intel® I219V, LAN2: Intel® i210IT
Interface
2 x RJ45
Storage
- HDD
1 x 2.5" HDD/SSD (up to 2 x 2.5" SSD by optional kit; 2 x 3.5" HDD by i-Module)
mSATA
1
NVMe
M.2 1 x M Key 2280 with PCIe Gen 4 x 4 (R680E SKU, operating temp. -20 ~ 50 °C)
RAID
0/1/5/10 (R680E SKU only)
I/O
- USB
R680E: 2 x USB3.2 (Gen2), 6 x USB3.2 (Gen1), 1 x USB 2.0 (Internal)
H610E: 4 x USB3.2 (Gen1), 4 x USB2.0
Serial Port
2 x DB9, RS-232/422/485 support auto flow control; 4 x RS-232 (Optional)
Audio
2 (1 x line out and 1 x mic in)
Expansion
- Module
Supports Advantech i-Modules
Mini PCIe/mSATA
R680E: 1 x mini PCIe, 1 x mini PCIe/mSATA
H610E: 1 x mini PCIe, 1 x mSATA
LED and Switch
- LED
2 (1 x Storage and 1 x Power), 4 for COM1 TX/RX and COM2 TX/RX
Button
1 x Power on/off switch
Remote Switch
Yes, 2pin terminal block (Optional)
Power
- Type
ATX/AT
Input Voltage
9 ~ 36 V DC
Power consumption
9~19V DC support total 140W
19~36V support total 180W
for system and Peripheral card
Watchdog Timer
- Output
System reset
Interval
Programmable 1 ~ 255 sec/min
Environment
65W CPU w/ industrial wide Temp. SSD | 35W CPU w/ industrial wide Temp. SSD | Non-operating | |
Temperature | -20 ~ 50 °C with 0.7 m/s air flow | -20 ~ 60 °C with 0.7 m/s air flow | -40 ~ 85 °C |
Humidity | 95% @ 40 °C (non-condensing) | ||
Vibration | With SSD: 3 Grms @ 5 ~ 500 Hz, random, 1 hr/axis With 2.5" HDD: 1 Grms @ 5 ~ 500 Hz, random, 1 hr/axis |
2G | |
Shock | With SSD: 20G, IEC-68-2-27, half-sine wave, 11 ms duration | 50G 11 ms |
Mechanical
- Dimensions (W x H x D)
77 x 192 x 230 mm (3.07" x 7.55" x 9.05")
Weight
2.8 kg (6.17 lbs)
Installation
Desktop/wall mount
Certifications
- EMC
CE/FCC Class A, CCC, BSMI
Safety
CB/UL, CCC, BSMI
OS Support
Windows 10, Windows 10 IoT, Linux OS
Note:
The CPU PCIe slot can support graphic cards only due to Intel design specification.
Other types of add-on cards will have no function installed on this slot
Packing List
Part Number | Description | Quantity |
---|---|---|
MIC-770 V3m | MIC-770 V3 bare system | 1 |
2041077040 | MIC-770 V3 startup manual (ENG+TC+SC) | 1 |
1652003234 | 4-pin Phoenix power connector | 1 |
1960070543T005 | 2 x Mounting bracket | 2 |
1700013095-01 | SATA cable | 1 |
1700024372-01 | SATA power cable | 1 |
2170000093-01 | CPU thermal grease | 1 |
1990019498N000 | RAM thermal pad | 2 |
Optional i-Modules*
Part Number | Description |
---|---|
MIC-75M13-00A2 | 4-slot expansion module (1 x PCIe and 3 x PCI slots) |
MIC-75M20-00C1 | 2-slot expansion module (2 x PCIe slots) |
MIC-75M20-01A2** | 2-slot expansion module (2 x PCIe slots) 2 |
MIC-75M11-00A2 | 2-slot expansion module (1 x PCIe and 1 x PCI slots) |
MIC-75S20-00A2 | 2-slot expansion and storage module (2 x PCIe and 2 x 2.5 removable 2.5" storage bay) |
MIC-75G20-10A2 | GPU Card expansion module (2 x PCIe and 2 x removable 2.5" storage bay) |
MIC-75G30-00A2** | Dual GPU card expansion module (3x PCIe and 2 x removable 2.5" storage bay) |
MIC-75GF10-00A1 | MXM GPU expansion i-Module (1 x PCIe and 2 x removable 2.5" storage bay) |
98R17520301 | 2 x 3.5" HDD kit |
* Please refer to i-Module datasheet for more detail.
** R680E SKU only
Embedded OS
Part Number | Description |
---|---|
TBD | TBD |
Optional Accessories
Part Number | Description |
---|---|
Adaptor | |
96PSA-A230W24P4-3* | ADP A/D 100-240V 230W 24V C14 TERMINAL BLOCK 4P |
1702002600 | Power cord (USA) UL/CSA, 3-pin, 10A, 125V, 1.83 M, 180 D |
1700008921 | Power Cord PSE 3P 7A 125V 183cm |
1702002605 | Power Cord (EU), 3-pin, 10A, 250V 1.83M, 90D |
Din Rail PSU | |
96PSD-A240W24-MN* | A/D 100-240V 240W 24V NDR DIN RAIL |
1700031170-01um | DC-DC power cord, A cable TEM*4/TEM*4 UL2464 18AWG 150cm |
1700029720-01 | AC-DC power cord (US), M cable AC CONN 3P 183cm |
1700030520-01 | AC-DC power cord (CN), M cable conn 3P CCC 10A 250V 150cm |
1700031408-01 | AC-DC power cord (EU), M cable conn 3P/G-TEM*3 80CM |
* Please use 230W adaptor when i-Module is added.
Note:
1. MIC-770 V3 supports Advantech iDoor modules (both MOS and PCM series), excluding the PoE model.
2. The PCM series module requires a bracket (P/N: 1960065854N001) that must be ordered separately.
Optional Flex I/O* & Kits
Part Number | Description |
---|---|
Flex I/O | |
AIIS-DIO32-00A1E** | AIIS GPIO module (32 bit) |
PCA-TPMSPI-00A1 | TPM 2.0 module (SPI) |
98R17500001 | MIC DVI FIO |
98R17500101 | MIC HDMI/Remote power on/off FIO |
98R17500301 | MIC HDMI kit FIO |
98R17500401 | MIC Remote power on/off FIO |
98R17500601 | MIC COMport kit FIO |
98R17500701 | MIC Remote power on/off kit for SFIO |
98R17500801 | MIC Reset/Remote power on/off/5VDC kit FIO |
98R17500901 | MIC GPIO kit FIO |
98R17501001 | MIC DP kit FIO |
98R17501101 | COM and HDMI kit |
Advanced Flex I/O*** | |
98910770301 | MIC NVMe + 4 LAN Advanced FIO |
98910770401 | MIC NVMe Advanced FIO |
98910770501 | MIC 4 PoE Advanced FIO |
Storage Kit | |
98R1752010E | 2nd 2.5" HDD/SSD kit (used in 2-slot i-Module) |
98R1752020E | 2 x 2.5" SSD kit (Thickness: 7mm) |
Mounting Kit | |
98R17500210 | MIC Din Rail Mounting kit |
98R17500501 | MIC Wall Mounting kit |
* Please refer to Flex I/O datasheet for more detail.
** AIIS-DIO32 requires a DB37 bracket (P/N: 1960068787N002)
*** R680E SKU only
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