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Produktgruppen > AI-Product-Solutions > SINTRONES ABOX-5221 ThermoSiphon™ Edge AI ...

SINTRONES ABOX-5221 ThermoSiphon™ Edge AI Computer

Intel® Core™ Processors (14th Gen) with Discrete GPU Options and High-Bandwidth 10GbE Edge AI Computer

SINTRONES ABOX-5221 ThermoSiphon™ Edge AI Computer
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  • EigenschaftenEigenschaften
  • BeschreibungBeschreibung
  • Weitere InformationenWeitere Informationen
  • Intel® Core™ Processor (14th Gen)
  • NVIDIA RTX™ Embedded and Intel® Arc™ GPU Options for Scalable AI Accelerating Solution
  • 2 x Marvell 10GbE for High-Bandwidth Uplink and Aggregated Downlink Connection
  • 4 x 2.5GbE with PoE+ Option Provides Simplied Connection to Edge Devices
  • Front Removeable RTC Battery Design for Easy Maintenance

Intel® Core™ Processors (14th Gen) with Discrete GPU Options and High-Bandwidth 10GbE Edge AI Computer

ProdGrafik

Specification


SYSTEM
Processor
  • Intel® Core™ (14th gen) i9-14900T 24C/32T processor
  • Intel® Core™ (14th gen) i7-14700T 20C/28T processor
  • Intel® Core™ (14th gen) i5-14500T 14C/20T processor
Graphics
  • Processor-integrated GPU - Intel® UHD Graphics 770
  • Optional discrete GPU - NVIDIA RTX™ Embedded 2000 Ada / 3500 Ada / 5000 Ada Intel® Arc™ A370E
Chipset R680E
Memory 2 x DDR5-5600 SO-DIMM up to 96GB
(ECC support with ECC DRAM)
Security TPM 2.0, dTPM
Watchdog Auto reset for unresponsive system
(custom 1-255 sec/min settings in BIOS)
INTERFACE
Video Without discrete GPU - 2 x HDMI® up to 3840 x 2160 @ 60Hz as specied in HDMI 2.0b
With discrete GPU - Additional 2 x DP++ up to 7680 x 4320 @ 60Hz
Audio 1 x Line-out, 1 x Line-in, 1 x Mic-in
Ethernet 2 x 10GbE (Marvell AQC113) via RJ-45 (optional M12 X-code)
4 x 2.5GbE (Intel I226) via RJ-45 (optional PoE+ and M12 X-code)
* ETH3 supports Intel® AMT
** All Ethernet ports support PXE boot and Wake-on-LAN
*** PoE supports 25.5W per port with total power budget: 120W
USB 8 x USB 3.2 Gen 2
DIO 8 x DI (DC 5-60V), 8 x DO (DC 5V/100mA)
COM 2 x RS-232/422/485
INTERNAL EXPANSION
M.2 1 x M.2 3042/3052 Key B for WWAN with dual SIM support
1 x M.2 2230 Key E for Wi-Fi/BT
* Thermal solution is required for M.2 5G module
Mini PCIe 2 x Mini PCIe (full-size)
STORAGE
Type 1 x M.2 2280 Key M for NVMe/SATA SSD
2 x M.2 2280 Key M for NVMe SSD
2 x Removable tray for 2.5" SATA SSD
* RAID 0/1/5 support via Intel® VMD.
POWER
Power Input DC 9-60V input (nominal power input DC 12V/24V/48V) via 5-pin terminal block
* Nominal power input of DC 24V or above is required for system with discrete GPU and PoE
Power Protection OCP, OVP, surge protection, reversed polarity protection
Power Management Ignition detection, Smart Power Management
RTC Battery Front removeable tray for RTC coin cell battery
Battey Backup Unit (BBU) Optional battery kit for up to 10 minutes emergency backup time
(Battery charging Temp. 0°C~45°C and discharging Temp. -10°C~60°C)
* BBU backup time varies depending on actual overall system power consumption
and battery is required to be charged before being used for system power backup
** Operating temperature will be limited within -10°C and 60°C with the battery kit installed.
Patent No.: M447854 (Built-in battery)
SOFTWARE
Operating System Windows 11 IoT Enterprise LTSC
Ubuntu 22.04 LTS
ENVIRONMENTAL
Operating Temp. -40°C ~ 70°C (-40°F ~ 158°F) with 0.6 m/s airow
* Operating temperature varies by accessories installed.
Storage Temp. -40°C ~ 85°C (-40°F ~ 176°F)
Relative Humidity 10% RH ~ 90% RH (non-condensing)
Vibration IEC 60068-2-64, random, 2.5G (Z) 0.21G (Y) 0.76 (Z)@5~500Hz, 1hr/axis
MIL-STD-810H, Method 514.8, Category 4
EN 61373:2010, Clause 8
Shock MIL-STD-810H, Method 516.8, 20G (11ms)
EN 61373:2010, Clause 10
CERTIFICATION / COMPLIANCE
  CE, FCC Class A, UKCA, E-Mark, EN 50155, EN 45545-2 (R25), IEC 62368-1
MECHANICAL
Construction Aluminum Alloy
Antenna 7 x SMA connector mounting hole
Mounting Wall mounting
Net Weight 5.70 kg (12.57 lb)
Dimensions (L x W x H) 290 x 250 x 98 mm (11.42 x 9.84 x 3.86 in.) with mounting brackets
Ingress Protection IP40




ORDERING INFORMATION


Model Number ABOX-5221(P)(G)(-M12X)-zz (P= w/ PoE, G=w/ Discrete GPU, M12X=w/ M12 X-coded connectors,
zz=i9=i9-14900T, zz=i7=i7-14700T, zz=i5=i5-14500T
Description Intel® Core™ Processors (14th Gen) with Discrete GPU Options and High-Bandwidth 10GbE Edge AI Computer
State of Origin   Made in Taiwan




OPTIONAL DISCRETE GPU


Discrete GPU Graphic Cores Memory Type/Size AI TOPS* System Operating Temp.
NVIDIA RTX™ Embedded 5000 Ada Generation 9728 CUDA / 304 Tensor GDDR6 16GB 682 0°C ~ 60°C
NVIDIA RTX™ Embedded 3500 Ada Generation 5120 CUDA / 160 Tensor GDDR6 12GB 369 0°C ~ 60°C
NVIDIA RTX™ Embedded 2000 Ada Generation 3072 CUDA / 96 Tensor GDDR6 8GB 232 0°C ~ 70°C
Intel® Arc™ A370E 8 X?-cores / 128 Execution Units GDDR6 4GB 56 0°C ~ 70°C


*AI TOPS Precision - FP8 for NVIDIA RTX™ Embedded Ada Generation, INT8 for Intel® Arc™.




OPTIONAL ACCESSORIES


Memory DDR5-5600 SO-DIMM, 8GB to 48GB, -40°C ~ 85°C (ECC option available)
Storage M.2 2280 Key M NVMe SSD w/ thermal kit, -40°C ~ 85°C
M.2 2280 Key B-M SATA SSD w/ thermal kit, -40°C ~ 85°C
2.5" SATA SSD, -40°C ~ 85°C
Wi-Fi M.2 2230 Key A-E Wi-Fi module, -40°C ~ 85°C
WWAN M.2 3042/3052 Key B WWAN module w/ thermal kit, -40°C ~ 85°C
GNSS M.2 2242 Key B GNSS module, -40°C ~ 85°C
Mini PCIe GNSS module, -40°C ~ 85°C
CAN Bus Mini PCIe CAN module, -40°C ~ 85°C
Battery (BBU) BAT-5200 battery kit, charging Temp. 0°C ~ 45°C, discharging Temp. -10°C ~ 60°C
Power Adapter   AC/DC 100-240V/24V 280W C14 bare wire power adapter



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